IS200JPDLG1ABC - Local Pack Power Distribution Board

IS200JPDLG1ABC - Local Pack Power Distribution Board IS200JPDLG1ABC - Local Pack Power Distribution Board

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SPECIFICATIONS

Part No.: IS200JPDLG1ABC
Manufacturer: General Electric
Country of Manufacture: United States of America (USA)
Size: 33.02 cm high x 10.16 cm wide
Current suppression: MOVs
Product Type: Local Pack Power Distribution Board
Availability: In Stock
Series: Mark VIe

Functional Description

IS200JPDLG1ABC is a local pack power distribution board developed by GE. It is a part of Mark VIe control system. The board plays a critical role in managing and distributing DC power within the system, specifically facilitating connections between the source of control power and multiple I/O packs. Its functionalities and design cater to efficient power distribution and redundancy within the system. JPDL board receives input power, usually 28 V dc, from sources like JPDP or JPDS, supporting up to three redundant feeds. The system is designed to ensure robustness and reliability through triple redundancy. The board efficiently manages the receipt of 28 V dc power, supporting triple redundancy through separate feeds and ensuring a common return current among these feeds, thereby enhancing the reliability and robustness of the system.

Power Distribution and Connection

  • Distribution Function: Serves as a central hub for the efficient distribution of DC power within the system. Its primary function is to manage the flow of power between the control power source and various I/O packs, ensuring that each component receives the necessary power supply for optimal operation.
  • Daisy Chain Connections: To streamline power distribution across the system, the module facilitates daisy chain-style connections. This innovative feature allows multiple downstream boards to be interconnected in a sequential manner, creating a structured and organized power distribution network.

Circuit Protection and Fuse Devices

  • Branch Circuit Protection: Ensuring the integrity and safety of the system, each connection to an I/O pack is equipped with branch circuit protection. This essential feature acts as a safeguard against potential overcurrent or short-circuit scenarios, minimizing the risk of damage to system components and ensuring uninterrupted operation.
  • Positive Temperature Coefficient Fuse Devices: To implement branch circuit protection effectively, positive temperature coefficient (PTC) fuse devices are utilized. These specialized devices offer reliable protection by automatically responding to abnormal current levels. In the event of an overcurrent or short-circuit condition, the resistance of the PTC fuse device increases rapidly, limiting the flow of current and effectively isolating the affected circuit from the rest of the system.

Control Power Redundancy and Circuit Isolation

  • Redundancy Implementation: The board is designed to facilitate up to three isolated control power distribution circuits, allowing for redundancy within the control hardware. This redundancy feature ensures system resilience and continuity of operation even in the event of a power-related failure.
  • Separation of Control Power: In systems following Triple Modular Redundancy (TMR), separate control power circuits for R, S, and T hardware are common. JPDL's provision for three separate power circuits on a single board allows organized separation of control power, enhancing system reliability and maintenance.

Features

  • Power Distribution: The board serves as a pivotal component in managing DC power distribution within the system. It efficiently allocates power between control power sources and multiple I/O packs, ennuring optimal performance and reliability.
  • Daisy Chain Connections: Facilitating streamlined power distribution, supports daisy chain connections, enabling interconnected power distribution across multiple downstream JPDL boards. This architecture simplifies wiring configurations and enhances system scalability.
  • Circuit Protection: Integral to its design, the board incorporates circuit protection mechanisms. It employs positive temperature coefficient fuse devices for each I/O pack connection, safeguarding against overcurrent conditions and ensuring the integrity of the system.
  • Redundancy and Circuit Isolation: It offers robust redundancy features, supporting up to three isolated control power distribution circuits. This capability enables organized separation and redundancy in control hardware, enhancing system resilience and fault tolerance.
  • Power Source: Typically, the board receives 28V DC power, sourced from either JPDP or JPDS modules, ensuring compatibility and seamless integration within the system architecture.
  • Redundant Feeds: For triple redundancy, the board provides three separate feeds - Red, Blue, and Black. These redundant feeds enhance system reliability by providing backup power sources in case of failure.
  • Connector Designation: Each separate feed is received via a 5-pin Mate-N-Lok connector, with distinct pins allocated for Red, Blue, and Black feeds. This design ensures redundancy and simplifies maintenance and troubleshooting procedures.
  • Connection Interface: The connection interface for the separate power feeds is facilitated through JP1, JP2, and JP3 connectors on the JPDP module, providing a seamless integration pathway within the system architecture.
  • Return Current: Return current from the redundant feeds is passed through the remaining two pins of the 5-pin connector, establishing a common return path among the redundant feeds. This ensures proper current flow and maintains system integrity.

Input Power and Redundancy

  • Power Source: JPDL typically receives 28 V dc power from JPDP or JPDS, with support for up to three separate feeds for redundancy.
  • Redundant Feeds: These feeds are designated as Red, Blue, and Black and are delivered separately to the 5-pin Mate-N-Lok input connector to ensure triple redundancy.

Connector and Pin Designation

  • 5-Pin Mate-N-Lok Connector: This connector facilitates the reception of the three separate power feeds, each allocated to different pins to maintain redundancy (Red, Blue, and Black).
  • JP1, JP2, and JP3 Connectors on JPDP: These connectors on JPDP provide the necessary connections for the three separate power feeds to the JPDL board.

Return Current Handling

  • Common Return Current: The return current, common among the three TMR (Triple Modular Redundancy) feeds, is passed through the remaining two pins of the 5-pin Mate-N-Lok connector. This arrangement ensures a common ground or return path among the redundant feeds.

The WOC team is always available to help you with your Mark VIe requirements. For more information, please contact WOC.

Frequently Asked Questions

What is IS200JPDLG1ABC?
It is a local pack power distribution board developed by GE under the Mark VIe series.

How many output circuits are provided by the board, and what is their purpose?
Six identical output circuits are available on the board, designed to supply power feeds individually to different I/O packs within the system.

What is the source of these output circuits, and how are they organized?
Two output circuits are sourced from each of the R, S, and T feeds (red, blue, and black), ensuring redundancy and balanced power distribution across the system.