IS200BPVAG1B - Backplane Assembly Board

SPECIFICATIONS:

Part Number: IS200BPVAG1B
Manufacturer: General Electric
Series: Mark VI
Number of Channels: 8
Maximum lead resistance: 15 Ohm
Product Type: Backplane Assembly Board
Microprocessor: Intel Pentium 133 MHz
Trip Solenoid Rating: 125 V dc
Ethernet interface: Thinwire 10-Base2
ISBus interface: Twisted pair RJ-45
Size: 33.0 cm wide x 17.08 cm
Technology: Surface Mount
Operating temperature: 0 to 60°C
No.of Analog Voltage Inputs: 6
Repair: 3-7 Day
Availability: In Stock
Country of Origin: United States

FUNCTIONAL DESCRIPTION:

IS200BPVAG1B is a Backplane Assembly Board manufactured and designed by General Electric as part of the Mark VI Series used in GE Speedtronic Control Systems. Backplanes are often preferred over cables due to their higher reliability. In cabled systems, frequent flexing of cables during the addition or removal of cards can lead to mechanical failures over time. In contrast, backplanes avoid this issue, with their lifespan primarily dependent on the durability of their connectors. A backplane can support various combinations of ISA, PCI, PCI-X, and PCI-e slots, depending on the SBC's capability to interface and manage them. For instance, an SBC with a modern i7 processor could connect to a backplane offering up to 19 ISA slots for legacy I/O cards.

FUNCTIONS OF BACKPLANE CARD:

• Certain backplanes, known as midplanes, feature slots on both sides for device connections. This dual-sided design is especially beneficial in larger systems composed mainly of modules connected to the midplane.

• Midplanes are commonly used in networking and telecommunications equipment, with one side of the chassis accommodating system processing cards and the opposite side supporting network interface cards.

• Orthogonal midplanes link vertical cards on one side to horizontal boards on the opposite side. A typical example is an orthogonal midplane that connects multiple vertical telephone line cards, each linked to copper telephone wires, to a horizontal communications card on the other side.

WOC has the largest stock of OEM Replacement Parts for GE Speedtronic Turbine Control systems. We can also repair your faulty boards and supply unused and rebuilt boards backed up with a warranty. Our team of experts is available round the clock to support your OEM needs. Our team of experts at WOC is happy to assist you with any of your automation requirements. For pricing and availability on any parts and repairs, kindly contact our team by phone or email.

FREQUENTLY ASKED QUESTIONS:

How does a Backplane Assembly Board handle high-speed data transmission?

High-speed data transmission in a backplane assembly board is crucial for performance, especially in applications like servers or telecommunications equipment. To manage this, backplanes use differential signaling, where pairs of traces carry opposite electrical signals to reduce noise and improve signal integrity.

What is the typical trace width for high-speed signal routing in a backplane?

The trace width for high-speed signal routing in a backplane assembly board is determined by a combination of factors, including the desired impedance, the copper thickness, and the distance from the signal trace to the reference plane.

What are the common communication protocols supported by Backplane Assembly Boards?

Backplane assembly boards support a range of communication protocols depending on the application requirements. Common protocols include PCIe (Peripheral Component Interconnect Express), which is used for high-speed data transfer between boards in computer systems.