IC3603A279A - Thermal Heat Sink Interface Module

SPECIFICATIONS:

Part Number: IC3603A279A
Manufacturer: General Electric
Product Type: Thermal Heat Sink Interface Module
Series: Mark I & II
Inputs: Up to 16 channel
Power Supply Voltage: 24 V dc
Pulse Width: Min 50 nanoseconds
Supply Voltage Range: 18-56 VDC
Block Power: 24/48 Volts DC
Output response time: 1.0 msec
Operating temperature: 10 to 40 ºC
Block to Block Isolation: 1500V
Size: 8.83 (22.44cm) x 3.50 (8.89cm) x 3.94
Availability: In Stock
Country of Origin: USA

FUNCTIONAL DESCRIPTION:

IC3603A279A is a Thermal Heat Sink Interface Module manufactured and designed by General Electric as part of the Mark II Series used in GE Speedtronic Control Systems. A Thermal Heat Sink Interface Module is a critical component for enhancing thermal management in electronics and high-power systems. It works by efficiently channeling heat from sources like CPUs, GPUs, or power modules to a heat sink or cooling device. Composed of high thermal conductivity materials such as thermal pads, grease, or phase-change substances, these modules establish a low-resistance heat pathway between contact surfaces. This facilitates effective heat dissipation, helping to prevent overheating and maintain the reliable, long-term performance of the device. Found across various applications—from consumer electronics and industrial equipment to automotive systems—these modules play a vital role in keeping sensitive components within safe operating temperatures, especially in settings with sustained high power outputs.

FUNCTIONS:

• Enhanced Thermal Conductivity: Optimizes heat transfer from heat-generating components to heat sinks by utilizing materials with high thermal conductivity, effectively lowering thermal resistance.

• Heat Management Support: Assists in redirecting excess heat from sensitive parts, enabling the cooling system or heat sink to release it more efficiently, thus reducing the risk of overheating.

• Surface Adaptability: Bridges microscopic gaps and imperfections between the heat source and heat sink surfaces, forming a more complete thermal interface and minimizing heat-blocking air pockets.

• Improved System Stability: Consistent temperature regulation helps avoid thermal throttling or unexpected shutdowns, supporting steady performance and extending component longevity.

• Electrical Insulation Capability: Certain thermal interface modules offer both electrical insulation and thermal conductivity, which is beneficial in scenarios requiring electrical isolation for safe operation.

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FREQUENTLY ASKED QUESTIONS:

What is a Thermal Heat Sink Interface Module?

A Thermal Heat Sink Interface Module is a component that enhances thermal management by facilitating heat transfer between heat-generating components (like CPUs or power modules) and cooling systems or heat sinks.

Why is thermal conductivity important in these modules?

Thermal conductivity is essential as it allows the module to transfer heat efficiently from hot components to the heat sink, reducing the chances of overheating and helping maintain optimal performance.

What materials are used in Thermal Heat Sink Interface Modules?

Common materials include thermal pads, thermal grease, and phase-change materials. These materials have high thermal conductivity and help bridge gaps between the heat source and the sink, enhancing heat flow.