IC3603A271B - Heat Sink Transistor Assembly Module

SPECIFICATIONS:

Part No: IC3603A271B
Manufacturer: General Electric
Product Type: Heat Sink Transistor Assembly Module
Series: Mark I & II
InputsUp to 16 channel
Operating temperature: 10 to 40 ºC
Power Supply Voltage: 24 V dc
Pulse Width: Min 50 nanoseconds
Connectors: RJ-45 synchronization
96-channel Digital I/O: 5V 4mA
Supply Voltage Range: 18-56 VDC
Block Power: 24/48 Volts DC
Output response time: 1.0 msec
Block to Block Isolation: 1500V
Size: 8.83 (22.44cm) x 3.50 (8.89cm) x 3.94
Availability: In Stock
Country of Origin: USA

FUNCTIONAL DESCRIPTION:

IC3603A271B is a Heat Sink Transistor Assembly Module manufactured and designed by General Electric as part of the Mark II Series used in GE Speedtronic Control Systems. The Heat Sink Transistor Assembly Module is a critical component in electronics, designed to manage and dissipate the heat generated by high-power transistors. Transistors, such as MOSFETs, BJTs, or IGBTs, control or amplify power within circuits, often operating under high current or voltage, which produces significant heat. The module combines these transistors with a heat sink—a metal structure, usually aluminum or copper, designed with fins or a complex surface to maximize surface area and improve heat dissipation. A thermal interface material (like thermal paste or pads) is also used between the transistor and heat sink to ensure optimal heat conduction, reducing the risk of overheating and extending component life.

FUNCTIONS:

• Heat Dissipation: Its primary function is to manage and dissipate the heat generated by transistors during operation. The heat sink absorbs heat from the transistor and releases it into the surrounding environment, preventing overheating.

• Thermal Management: By keeping the transistor at a stable operating temperature, the module ensures that temperature fluctuations do not affect the transistor's performance or cause thermal stress, which could lead to component degradation over time.

• Enhanced Reliability and Component Protection: Proper heat management prevents the transistor from reaching critical temperatures, thus protecting it from thermal damage, extending its life, and enhancing system reliability.

• Efficient Power Handling: In applications where power transistors manage high current loads, the heat sink ensures they operate efficiently without heat-induced performance issues, supporting uninterrupted power regulation and signal control.

• System Stability and Performance: The module maintains optimal operating temperatures for control electronics, preventing malfunctions due to overheating and ensuring stable performance in critical systems like motor controls, power supplies, and industrial control systems.

• Vibration Resistance: With secure mounting, the assembly withstands vibrations in environments like automotive or industrial settings, where maintaining stable contact between the transistor and heat sink is essential for consistent performance.

WOC has the largest stock of OEM replacement parts for GE Speedtronic Gas Turbine Control Systems. We can also repair your faulty boards and supply unused and rebuilt boards backed up with a warranty. Our team of experts is available round the clock to support your OEM needs. Our team of experts at WOC is happy to assist you with any of your automation requirements. For pricing and availability on parts and repairs, kindly contact our team by phone or email.

FREQUENTLY ASKED QUESTIONS:

What is a Heat Sink Transistor Assembly Module?

A Heat Sink Transistor Assembly Module is an electronic component that combines high-power transistors with a heat sink to dissipate heat generated during operation. It prevents overheating and ensures stable performance in high-power applications like power supplies, motor controllers, and industrial control systems.

Why is heat dissipation important for transistors?

Transistors in high-power applications generate significant heat, which can cause overheating, reduced performance, and even permanent damage. Proper heat dissipation maintains stable operation, extends component lifespan, and ensures system reliability.

What types of transistors are typically used in these modules?

Common transistor types include MOSFETs, BJTs (Bipolar Junction Transistors), and IGBTs (Insulated Gate Bipolar Transistors). The choice depends on the application's power requirements and control specifications.