IC3603A167A - Heat Sink / Transistor Assembly Module

SPECIFICATIONS:

Part No: IC3603A167A
Manufacturer: General Electric
Product Type: Heat Sink / Transistor Assembly Module
Series: Mark II
Transistor Type: MOSFET, IGBT, BJT
Power Dissipation: 10W to 500W
Thermal Resistance (RθJC): 0.5°C/W
Max Junction Temperature: 125°C
Operating temperature: -30 to 55 ºC
Power Supply Voltage: 24 V dc
Board Size: 2.8 cm high x 8.6 cm
Weight: 0.45 kg
Availability: In Stock
Country of Origin: USA

FUNCTIONAL DESCRIPTION:

IC3603A167A is a Heat Sink / Transistor Assembly Module manufactured and designed by General Electric as part of the Mark II Series used in GE Speedtronic Control Systems. A Heat Sink / Transistor Assembly Module is an integrated unit combining a power transistor and a heat dissipation mechanism (heat sink) to ensure efficient thermal management in high-power electronic systems. The transistor in this module—typically a MOSFET, IGBT, or BJT—acts as a switching or amplification device. During switching or current regulation, the transistor dissipates electrical energy as heat due to conduction losses and switching losses.

KEY FEATURES OF HEAT SINK TRANSISTOR ASSEMBLY:

• Thermal Resistance and Heat Flow: The article introduces the concept of thermal resistance, measured in degrees Celsius per watt (°C/W), which quantifies a heatsink's ability to dissipate heat. It explains how heat flows from the transistor's junction through various interfaces before reaching the ambient environment, and how each interface contributes to the overall thermal resistance.

• Transistor Mounting Techniques: Proper mounting of transistors onto heatsinks is crucial. The document discusses the use of thermal interface materials (TIMs) like mica insulators and thermal compounds to enhance thermal conductivity between the transistor case and the heatsink. It also covers the importance of ensuring flatness and cleanliness of mating surfaces to minimize thermal resistance.

• Heatsink Design Considerations: Various heatsink designs are examined, including fin configurations and surface treatments. The document highlights how factors like fin spacing, surface area, and material choice (e.g., aluminum vs. copper) influence a heatsink's performance. It also touches on the impact of environmental conditions, such as altitude, on heatsink efficiency.

• Thermal Inertia and Transient Response: Beyond steady-state thermal resistance, the article addresses thermal inertia—the ability of a system to absorb heat without a significant temperature rise. This aspect is vital for applications with fluctuating power levels, ensuring that temperature spikes are mitigated.

• Practical Tips and Common Pitfalls: The author provides practical advice on selecting appropriate heatsinks based on power dissipation requirements, avoiding common mistakes like over-reliance on thermal compound thickness, and ensuring mechanical stability to prevent damage during thermal cycling.

MEASURING HEATSINK THERMAL RESISTANCE:

The most accurate way to determine the thermal resistance of an unknown heatsink is to measure it. The exercise is not trivial, though, since you will require a large metal-clad resistor having a good flat bottom surface (or you can use transistors), a contact thermometer (a conventional alcohol in glass thermometer cannot be used), and a suitable low-voltage, high-current power supply. If you have a large number of heatsinks to test, it may be worthwhile to build a dedicated test unit, however, this is unlikely for most home constructors.

The heatsink under test must be set up as closely as possible to the way it will be used. There is no point testing a sink just lying on the workbench (for example), as the results will be way off. If a heavy chassis is planned, then attach the heatsink to the chassis or a reasonable facsimile thereof. Ensure that the heating system is in the best possible thermal contact with the heatsink. Thermal compound is essential, and do not use any insulators.

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FREQUENTLY ASKED QUESTIONS:

What is a Heat Sink / Transistor Assembly Module?

A Heat Sink / Transistor Assembly Module is a combined unit consisting of a power transistor (such as a MOSFET, IGBT, or BJT) and a heat sink designed to dissipate the heat generated by the transistor during operation. This module ensures that the transistor remains within its safe operating temperature range, preventing overheating and potential damage.

Why is thermal management important for transistors?

Thermal management is critical for transistors because excessive heat can cause damage, reduce efficiency, or lead to failure. Transistors dissipate energy in the form of heat during switching or amplification processes, and if this heat is not properly managed, it can lead to thermal runaway, where increasing temperature leads to further heat generation and eventual device destruction.

How does the heat sink work with the transistor?

The heat sink acts as a heat dissipation mechanism that draws heat away from the transistor’s case. The heat is conducted through the heat sink's material (often aluminum or copper) and dissipated into the surrounding air, typically through convection. The heat sink is designed with increased surface area (via fins or pins) to maximize the area available for heat transfer.