DS3820HSMC1 - Heat Sink Assembly Module

SPECIFICATIONS:

Part No: DS3820HSMC1
Manufacturer: General Electric
Series: Mark IV
Product Type: Heat Sink Assembly Module
Heat Dissipation Capacity: 300 Watts
Current per TEC Series: 7.5 A
Voltage per TEC Series: 40 V
Fan Voltage: 7.0 ~ 13.5 VDC
Fan Power: 16 W
Noise Level per Fan: 50 dBA
Input Range: 0-10 V, 4-20 mA
Power Requirements: 24V DC,
Output Range: 0-10 V, 4-20 mA
Dimensions: 13.528 x 8.466 x 3.820
Operating Temperature: -20°C to +70°C
Weight: 5 kg
Country of Origin: USA
Availability: In Stock

FUNCTIONAL DESCRIPTION:

DS3820HSMC1 is a Heat Sink Assembly Module manufactured and designed by General Electric and is part of the Mark IV Series used in GE Speedtronic gas turbine control systems. A Heat Sink Assembly Module is an essential component designed to manage and dissipate the heat generated by electronic devices, ensuring they operate within safe temperature limits. These modules are crucial in maintaining the reliability and longevity of components such as CPUs, GPUs, power transistors, and other high-power semiconductors by preventing overheating. The assembly typically includes a heat sink, often made from materials like aluminum or copper due to their excellent thermal conductivity properties.

The heat sink features a series of fins that increase the surface area in contact with the cooling medium, usually air, thereby enhancing heat dissipation. In addition to the heat sink, the assembly often includes thermal interface materials (TIM) like thermal paste or pads that ensure efficient heat transfer between the component and the heat sink. Some heat sink modules incorporate fans or blowers to enhance air movement across the fins, known as active cooling solutions, while passive heat sinks rely solely on natural convection. The design and structure of a heat sink can vary significantly, tailored to the specific thermal management needs of different applications. These modules are indispensable in a wide range of industries, from computing and power electronics to LED lighting and automotive electronics, providing critical thermal management to ensure optimal performance and durability of electronic devices.

FUNCTIONS:

• Heat Dissipation: The core function of a heat sink is to dissipate the heat generated by electronic components into the surrounding environment. By increasing the surface area in contact with the cooling medium, heat sinks enhance the efficiency of heat transfer and prevent the component from overheating.

• Temperature Regulation: Heat sinks help maintain the operating temperature of electronic components within safe limits. This regulation is crucial for preventing thermal damage and ensuring the reliable performance and longevity of the devices.

• Performance Optimization: By keeping temperatures in check, heat sinks help maintain the optimal performance of electronic components. Overheating can lead to reduced efficiency and performance degradation, so effective heat management is essential for peak operation.

• Prevention of Thermal Throttling: In many electronic devices, if the temperature exceeds a certain threshold, the system may throttle performance to reduce heat generation. Heat sinks help mitigate this risk by keeping temperatures lower, thus avoiding performance throttling.

• Enhanced Reliability: Overheating can cause thermal stress, leading to component failure or reduced lifespan. By efficiently managing heat, heat sinks contribute to the overall reliability and durability of electronic devices.

• Protection of Surrounding Components: Effective heat dissipation also helps protect nearby components from heat damage. This is especially important in densely packed electronic assemblies where heat from one component can affect others.

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FREQUENTLY ASKED QUESTIONS:

What materials are commonly used in heat sinks?

Common materials include aluminum, which is lightweight and cost-effective, and copper, which has superior thermal conductivity but is heavier and more expensive. Some high-performance heat sinks may use a combination of these materials.

What is thermal interface material (TIM), and why is it important?

Thermal interface material (TIM) is a substance applied between the electronic component and the heat sink to fill microscopic gaps and improve thermal conductivity. It is crucial for efficient heat transfer and effective cooling.

What is the difference between passive and active heat sinks?

Passive heat sinks rely solely on natural convection to dissipate heat and do not include any moving parts. Active heat sinks incorporate fans or blowers to enhance air movement and improve heat dissipation efficiency.