IS230PCCAH1B - Core Analog Power Connect Card

SPECIFICATIONS

Part No.: IS230PCCAH1B
Manufacturer: General Electric
Country of Manufacture: United States of America (USA)
Trip solenoids 3 solenoids per TRPG
Solenoid rated voltage: 125 V dc
Solenoid rated current: 1 A
Product Type: Core Analog I/O module
Availability: In Stock
Series: Mark VIe

Functional Description

IS230PCCAH1B is a Core Analog I/O module developed by GE. It is a part of Mark VIe control system. The I/O packs in the Mark VIe control system play a vital role in signal processing, fault detection, communication, and system monitoring. By combining specialized hardware and software components, these packs ensure reliable operation and facilitate efficient management of connected devices. The integration of temperature sensors further enhances system reliability by enabling proactive monitoring and mitigation of potential thermal issues.

Key Components

• Processor Board: This generic board handles data processing, communication with the Mark VIe controller, and other core functions.
• Data Acquisition Board: Tailored to the specific connected device, this board manages the digitization of analog signals and other data for processing.
  These components work together to execute system algorithms, facilitate communication with the controller, and ensure the proper functioning of connected devices.

Diagnostics

• The module incorporates a comprehensive fault detection system, which leverages specialized circuitry in the data acquisition board alongside software on the processor board. This combination enables the system to identify potential faults within the I/O pack quickly, ensuring that any issues are detected and managed promptly to maintain system integrity.
• When a fault is detected, its status is transmitted to the Mark VIe controller. This communication provides critical information to system operators, enabling real-time monitoring and timely corrective action. The feedback from the I/O pack helps minimize downtime, maintain system performance, and support efficient troubleshooting processes.

Dual Network Interface Communication

The I/O packs support communication with the Mark VIe controller through dual Ethernet network interfaces. This feature provides redundancy in communication, ensuring reliable data exchange even if one network connection fails. This dual-interface approach enhances overall communication reliability between the I/O packs and the control system.

Identification Message Transmission

Each I/O pack is capable of transmitting an identification message (ID packet) to the Mark VIe controller upon request. 

• Hardware catalog number
• Hardware revision
• Board barcode serial number
• Firmware catalog number
• Firmware version

This data facilitates accurate identification, tracking, and management of I/O pack components within the system.

Temperature Monitoring

The module is equipped with temperature sensors, which provide accurate readings within ±2°C. These sensors continuously monitor the temperature within the I/O pack, logging the data into the system database. If the temperature exceeds a predefined threshold, an alarm is triggered, allowing operators to take corrective action before overheating can cause system issues.

Integrated Design

It embodies an integrated design by consolidating four separate circuit boards into a single physical assembly. This approach optimizes space utilization within the control system and simplifies the installation process. The integrated design helps streamline the module's integration into the overall Mark VIe control system architecture.

Wiring

• Shield Termination Points: The JGPA provides forty-eight shield termination points, marked in green, to ensure proper grounding and shielding of cables. Shield termination is essential for minimizing electromagnetic interference and maintaining signal integrity within the control system.
• 24 V DC Output Terminals: In addition to shield termination points, the JGPA board also offers twelve 24 V DC output terminals, marked in orange. These terminals are specifically designed to supply power to 4-20 mA transmitters, facilitating the operation of various sensors and devices within the control system.
• Wiring Procedure: During the wiring process, cables are connected to the appropriate terminals on both the module and the JGPA board. Proper cable routing and termination techniques are employed to ensure secure and reliable connections.
• Integration with Control System:Once the wiring connections are established, the module and JGPA board are integrated into the broader control system setup. This integration allows for seamless communication and interaction between different components, facilitating efficient operation and control of industrial processes.

The WOC team is always available to help you with your Mark VIe requirements. For more information, please contact WOC.

Frequently Asked Questions

What is IS230PCCAH1B?
It is a Core Analog I/O module developed by GE under the Mark VIe series.

What components make up an I/O pack in the Mark VIe control system?
Each I/O pack consists of a generic processor board and a data acquisition board tailored to the connected device. These components work together to digitize signals, execute algorithms, and communicate with the Mark VIe controller.

How does the I/O pack provide fault detection?
Fault detection in the I/O pack is achieved through a combination of specialized circuitry in the data acquisition board and software running on the Central Processing Unit (CPU) board. This comprehensive approach ensures the timely detection and identification of faults within the I/O pack, enhancing system reliability.

How is fault status transmitted from the I/O pack to the controllers?
The Fault status detected is transmitted to the controllers, providing critical information for system monitoring and maintenance. This real-time feedback enables operators to promptly address issues, minimizing downtime and optimizing system performance.