IC3603A163A - Heat Sink Transistor Assembly

SPECIFICATIONS

Part No.: IC3603A163A
Manufacturer: General Electric
Country of Manufacture: United States of America (USA)
Product Type: Heat Sink Transistor Assembly
Availability: In Stock
Series: VersaMax

Functional Description

IC3603A163A is a Heat Sink Transistor Assembly developed by GE. This assembly is integral to managing heat dissipation in high-performance electronic devices, ensuring optimal operation and reliability.

Features

• Thermal Management: The primary function of the assembly is to effectively dissipate heat generated by transistors during operation. By maintaining lower temperatures, it enhances the performance and longevity of the electronic components.
• Robust Design: The heat sink is constructed from materials with excellent thermal conductivity, allowing for efficient heat transfer away from the transistor. This design helps prevent overheating, which can lead to component failure.
• Compatibility: Eengineered to be compatible with a variety of GE's power transistor modules, making it a versatile choice for various applications. Its modular design allows for easy integration into existing systems.
• Assembly and Installation: The assembly includes mounting features that simplify the installation process, allowing for quick setup and maintenance. Proper installation is crucial for ensuring maximum thermal performance and reliability.
• Electrical Insulation: The heat sink assembly is designed to provide electrical insulation between the transistor and the mounting surface, preventing short circuits and enhancing safety during operation.
• Wide Operating Range: can operate effectively across a broad range of temperatures, making it suitable for use in demanding environments where temperature fluctuations are common.
• Durability: Built to withstand harsh industrial conditions, this assembly is resistant to environmental factors such as moisture and dust, ensuring reliable performance in various settings.

The WOC team is always available to help you with your Mark I and II requirements. For more information, please contact WOC.

Frequently Asked Questions

What is IC3603A163A?
It is a Heat Sink Transistor Assembly developed by GE under mark I and II series.

What materials are used in the construction of the assembly?
The heat sink assembly is constructed from materials with high thermal conductivity to enhance heat transfer. These materials are selected for their durability and ability to withstand harsh industrial conditions.

How does the assembly improve the performance of electronic devices?
By effectively dissipating heat, the assembly prevents overheating, which can lead to component failure. This thermal management improves the overall performance and reliability of electronic devices in which it is used.